general specifications flanged attenuators 25 watts model rfp-25-xxap resistive element: thick film substrate: beryllium oxide ceramic cover: alumina ceramic mounting flange: copper, nickel plated per qq-n-290 lead(s): 99.99% pure silver (.005?thk) outline drawing .062 max. .100 .130 .125 thru .116 .250 typ. .125 .125 .515 .050 notes: t olerance is .010, unless otherwise specified. operating temperature is -55? to +150? (see chart). designed to meet or exceed applicable portions of mil-e-5400. all dimensions are in inches. lead length 0.15?minimum. specifications subject to change without notice. electrical specifications attenuation value: 1, 2, 3, 4, 5, 6, 9, 10, 20 or 30 db frequency range: dc - 3.0 ghz power: 25 watts flanged attenuators features dc - 3.0 ghz 25 watts beo ceramic ? elded silver leads non-nichrome resistive element low vswr 100% tested 1 sales desk usa: v oice: (800) 544-2414 fax: (315) 432-9121 sales desk europe: v oice: (+44) 23 92 232392 fax: (+44) 23 92 251369 note: xx denotes attenuation value. rfp 25-xx ap ver. 12/5/01
case temperature ? c % of rated power 150 125 100 75 50 25 100 75 25 50 0 flanged attenuators model rfp-25-xxap 2 sales desk usa: v oice: (800) 544-2414 fax: (315) 432-9121 sales desk europe: v oice: (+44) 23 92 232392 fax: (+44) 23 92 251369 power derating suggested mounting procedures with lead. board even min. .025 (2 places) board lower than lead. suggested stress relief methods scale: 1. make sure that the devices are mounted on flat surfaces (.001 under the device) to optimize the heat transfer. 2. drill & tap the heatsink for the appropriate thread size to be used. 3. coat heatsink with a minimum amount of high quality silicone grease (.001 max. thickness). 4. position device on mounting surface and secure using socket head screws, flat & split washers. torque screws to the appropriate value. make sure that the device is flat against the heatsink. (care should be taken to avoid upward pressure of the leads towards the lid). 5. solder leads in place using an sn63 type solder with a controlled temperature iron (210?c). not recommended application board lower than lead. than lead. board higher scale: specifications pa rt number attenuation (db) tol. (+/-db) power (watts) vswr freq. (ghz) rfp-25-1ap 1 0.50 25 1.20:1 3.0 RFP-25-2AP 2 0.50 25 1.20:1 3.0 rfp-25-3ap 3 0.50 25 1.20:1 3.0 rfp-25-4ap 4 0.50 25 1.20:1 3.0 rfp-25-5ap 5 0.50 25 1.20:1 3.0 rfp-25-6ap 6 0.50 25 1.20:1 3.0 rfp-25-9ap 9 0.75 25 1.35:1 3.0 rfp-25-10ap 10 0.75 25 1.35:1 3.0 rfp-25-20ap 20 0.50 25 1.20:1 3.0 rfp-25-30ap 30 1.00 25 1.20:1 3.0
|
